cen techonology

  Understanding PCB Baking in the PCB Assembly Process As a professional electronic manufacturing service provider specializing in  PCB assembly , we at  CEN PCBA   place immense importance on processes that ensure the reliability and performance of printed circuit boards (PCBs). One such critical process is PCB baking. This article delves into the intricacies of PCB baking, its necessity, and its role in delivering top-quality electronic assembly solutions. What is PCB Baking? PCB baking is a crucial step in the  PCB assembly  process designed to remove moisture from the printed circuit boards. Moisture can be a significant problem in PCBs, as it can become trapped within the board’s layers. When exposed to the high temperatures of soldering processes, this moisture can turn into steam, potentially causing delamination or other damage to the PCB. The effectiveness of PCB baking is influenced by the composite materials used in the board. For instance, polyi...

  What is First Article Inspection in the PCB Assembly Process？ At CEN Electronics, we prioritize quality and customer satisfaction through our comprehensive first article sampling services. Central to this process is First Article Inspection (FAI), a critical step that ensures the initial PCB produced in each  assembly  stage meets the highest standards. This master circuit board undergoes meticulous inspection and testing, serving as the benchmark for calibrating, programming, and verifying the proper functioning of our assembly equipment. Comprehensive First Article Inspection Process FAI at CEN Electronics involves a multi-faceted approach, incorporating: Parts Management : Ensuring all components match the customer’s design specifications and Bill of Materials (BOM). 3D Solder Paste Inspection (SPI) : Verifying the accuracy and quality of solder paste application. Automated Optical Inspection (AOI) : Utilizing advanced  AOI  and 3D AOI systems to detect any...

  Introduction:   In today's dynamic realm of electronics, switching power supplies   have become ubiquitous due to their compactness, lightweight design, and high efficiency. However, alongside their widespread adoption comes the persistent challenge of electromagnetic compatibility (EMC), particularly in relation to noise generation. In this article, we delve into the intricacies of Switching Power Supply Board (SMPS) noise, its root causes, and effective strategies for mitigation. Root Causes of Switching Power Supply Board (SMPS) Noise: Voltage Stability and Ripple: Switching Power Supply Board (SMPS) noise often stems from voltage instability and ripple on the output. This instability can result from errors in the voltage regulator chip's DC output or fluctuations in the amplitude of power supply noise. Ripple is generated when the residual power supply noise is insufficient due to instability in the voltage regulator chip's output. Voltage stability is crucial for e...

  As the demand for energy-efficient heating and cooling solutions continues to rise, heat pumps have emerged as a popular choice for residential and commercial applications. At the heart of these innovative systems lies the PCBA (Printed Circuit Board Assembly), which serves as the central nervous system, orchestrating the complex operations of the heat pump. What we do for heat pump? CEN stands at the forefront of the electronics manufacturing industry, leveraging cutting-edge technologies and expertise to produce high-quality  PCBA  control boards for heat pumps. With a commitment to excellence and innovation, CEN is redefining the standards of performance and reliability in the HVAC sector. heat-pump Utilizing state-of-the-art equipment and stringent quality control measures, CEN ensures the precise assembly of components on each  PCBA  for heat pumps. Advanced AOI (Automated Optical Inspection) and X-ray technologies are employed to detect and rectify any p...